Studies of ENR-25/TiO2 Composites for Electronic Materials Packaging Applications

Biopolymer-based Lightweight Materials for Packaging Applications

This chapter offers an overview of the biopolymer-based lightweight materials with respect to their potential for packaging applications. The biopolymer-based materials have garnered increasing attention to packaging market due to the concerns from both environmental and economical perspectives of traditional petroleum based polymers in recent years. The largely use of these traditional synthet...

Jet Dispense for Electronic Packaging Applications

The scale of components used has consistently grown smaller and denser with the advances and improvements in technology of the electronics and optoelectronic industry,. This has allowed for more efficient use of resources (a silicon chip that once held hundreds of transistors now holds millions) and more convenient and consumer friendly products (palm sized computers compared to warehouse sized...

Closed porosity aluminosilicate for electronic packaging applications

The electrical properties of sol-gel prepared aluminosilicate films were investigated for suitability in electronic applications. The aluminosilicate films exhibited apparent closed porosity and a dielectric constant as low as = 5 with processing temperatures from 373 K to 873 K. The porosity was inaccessible to nitrogen at 77 K, helium at 293 K, and water vapor at 293 K. Both bulk and thin-fil...

Carbon Nanotube Composites for Electronic Interconnect Applications

Active Packaging for Food Applications - A Review

The purpose of food packaging is to preserve the quality and safety of the food it contains from the time of manufacture to the time it is used by the consumer. Recently, the demand for safe and high quality foods, as well as changes in consumer preferences have led to the development of innovative and novel approaches in food packaging technology. One such development is the active food packag...